CAPABILITIES
Assembly Capabilities for PCBs
| ITEM | PCB | FLEX | RIGID-FLEX |
|---|---|---|---|
| Max Layer | 60L | 8L | 36L |
| Inner Layer Min (Trace/Space) | 3/3mil | 3/3mil | 3/3mil |
| Out Layer Min (Trace/Space) | 3/3mil | 3.5/4mil | 3.5/4mil |
| Inner Layer Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 10oz | 2oz | 3oz |
| Min Mechanical Drilling | 0.15mm | 0.1mm | 0.15mm |
| Min Laser Drilling | 0.1mm | 0.1mm | 0.1mm |
| Aspect Ratio (Mechanical Drilling) | 20:1 | 10:1 | 12:1 |
| Aspect Ratio (Laser Drilling) | 1:1 | / | 1:1 |
| Press Fit Hole Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| Countersink Tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
| Board Thickness | 0.2~8mm | 0.1~0.5mm | 0.4~3mm |
| Board Thickness Tolerance (＜1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Board Thickness Tolerance (≥1.0mm) | ±10% | / | ±10% |
| Impedance Tolerance | Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) Difference：±5Ω(≤50Ω)，±7%(＞50Ω) | Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Difference：±5Ω(≤50Ω)，±10%(＞50Ω) | Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Difference：±5Ω(≤50Ω)，±10%(＞50Ω) |
| Min Board Size | 5*5mm | 5*10mm | 10*10mm |
| Max Board Size | 22.5*30 inch | 9*14 inch | 22.5*30 inch |
| Contour Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
| Min BGA | 7 mil | 7 mil | 7 mil |
| Min SMT | 7*10 mil | 7*10 mil | 7*10 mil |
| Surface Treatment | Electroplated Nickel Gold, ENIG, Gold Finger, ImmersionSilver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating, Soft Gold Plating, Nickel Palladium | Electroplated Nickel Gold, ENIG, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating, Soft Gold Plating, Nickel Palladium | Electroplated Nickel Gold, ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating, Soft Gold Plating, Nickel Palladium |
| Solder Mask | Green, Black, Blue, Red, Matte Green | Green solder mask / black cover film or yellow cover film | Green, Black, Blue, Red, Matte Green |
| Min Solder Mask Clearance | 1.5 mil | 3 mil | 1.5 mil |
| Min Solder Mask Dam | 3 mil | 8 mil | 3 mil |
| Legend | White, Black, Red, Yellow | White, Black, Red, Yellow | White, Black, Red, Yellow |
| Min Legend (Width/Height) | 4/23 mil | 4/23 mil | 4/23 mil |
| Strain Fillet Width of Single layer board | / | The Board Thickness is 3-6 Times | The Board Thickness is 3-7 Times (Flexible board thickness) |
| Strain Fillet Width of Double layer board | / | The Board Thickness is 6-10 Times | The Board Thickness is 6-11 Times (Flexible board thickness) |
| Strain Fillet Width of Multi-layer board | / | The Board Thickness is 10-15 Times | The Board Thickness is 10-16 Times (Flexible board thickness) |
| Strain Fillet Width of Dynamic | / | The Board Thickness is 20-40 Times | The Board Thickness is 20-40 Times (Flexible board thickness) |
| Dispensing Width | / | 1.5±0.5mm | 1.5±0.5mm |
| Warpage (minimum) | 0.30% | / | 0.05% |